Develop AI-ready campuses where power and connectivity converge.
Develop and build cutting-edge, high-density HPC data centers with expandable power capacity in growing Tier 2 and Tier 3 markets where power resources are readily available.
Purpose-built to meet the power and cooling requirements of current and emerging AI GPU and CPU workloads.
Designed to deliver unparalleled computational power, efficiency, and scalability, driving innovation and enabling continued breakthroughs in AI research and applications.
Utilizing proven cooling technologies to support the most demanding high-density computing environments.
Serving hyperscalers, GPUaaS providers, and large enterprise platforms.
Data Center Overall Design Parameters
General
Tier 3 specifications with the ability to deploy globally.
100% uptime SLA.
24/7 security with biometric access controls.
Next-generation CCTV systems.
24/7 remote and smart hands services.
V.E.S.D.A. with dry-pipe fire suppression systems.
Customer portal access.
Mechanical
Hybrid cooling strategy utilizing Direct-to-Chip and RDHX cooling infrastructure.
Advanced liquid cooling loops.
Capability to cool up to 250kW per cabinet.
N+1 redundancy.
Environmental monitoring and automation.
Target PUE of 1.3 or lower.
Electrical
Best-in-class, industry-proven critical power infrastructure.
N+1 configuration or N+2C continuous power availability.
On-site generators capable of supporting the full data center load.
UPS systems for all critical infrastructure to ensure seamless power transitions.
PDUs with separate paths for A and B power feeds.
Network
Redundant network paths designed to minimize downtime.
High-speed networking capabilities, including InfiniBand and 100GbE.
Low-latency architecture optimized for high-performance workloads.
